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Meritec’s new ROAD RUNNER Family of Products
is Meritec’s innovative solution for a high speed, high density co-planar
board-to-board interconnect. It is capable of over 1,000 single-ended signals
per connector with a density of over 114 signals per linear inch. The Road
Runner Modular Connector System includes Power Wafers (3 buses per wafer),
Single Mode Wafers (9 signals per wafer) and Differential Mode Wafers (4 pairs per wafer) that can be arranged per our Customer’s specific requirements. This Interconnection System supports modular add-on boxes for Central Office Switches, Access and Edge Devices, Datacom Routers and Enterprise Storage Subsystems. hese High-density High Pin-count Connectors are utilized within highest slot/blade count servers and storage expanded backplane systems. Co-planar test board applications using Road Runner are supported with single-ended and differential signaling modules along with power modules. Large system motherboards with co-planar "personality add-in cards" are using Road Runner modular I/O press-fit hermaphroditic connectors. Large scale mirrored fault-tolerant servers and electrical SONET Communications Failover Backplane Systems can be implemented with co-planar Road Runner "Bridge" Connectors. High-end Video servers with expanded backplanes using Road Runner Connectors support SMPTE 1.5 Gbs Serial Digital Interfaces as well as the HOTLINK-II™ Modular Interface.
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Price/Performance optimized co-planar board-to-board solutions for connecting: |
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Test Report: Comparison of Electrical
Characteristics of Meritec's Road Runner and Teradyne's VHDM-RAM® Single-ended 50 ohm Co-planer Connectors |
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Last update July 25, 2005
